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Next Day Air Only
Calif. Prop 65
- Description
- Specifications
- Documents
- Low-voiding water-soluble flux for solder paste: Reduced largest voids, Fewer voids, Minimized voiding overall, For BGA, CSP, and bottom termination components, such as QFNs and DPAKs
- • Exceptional printing process window: Excellent response-to-pause, Long stencil life, Prints consistently at a wide range of speeds
- Wide reflow process window
- Excellent wetting on a variety of surface finishes
- Maintains tack over time
- Outstanding cleanability
Indium6.6HF is a versatile, water-soluble solder paste flux, formulated for air or nitrogen reflow. It is capable of SnPb and Pb-free assembly processes with an exceptional reflow process window. This solder paste provides exceptional stencil printing performance, with long stencil life and excellent response-to-pause.
Indium6.6HF exhibits superior wetting to a variety of surface finishes and exhibits the best voiding performance, with fewest voids, reduced size of largest voids, and overall minimized voiding for BGAs, CSPs, and BTCs (QFNs, DPAKs, LGAs, etc.).
Brand:Â Indium Solder
Alloy:Â SAC305
Alternate Product Number:Â SAC305
Flux Type:Â ORH0
Series:Â 6.6HF Series
Type:Â Solder Paste
Lead Free:Â Yes
Package Type:Â Cartridge
Lead Type:Â Lead Free
Physical State:Â Paste
Volume:Â 600 g
Powder Mesh Size:Â T4
Metal %:Â 88.5 %
Composition:Â 96.5% Tin, 3% Silver, 0.5% Copper
Flux Characteristics:Â Water Soluble
Package:Â 600g Cartridge
Shelf Life:Â 6 months
Water Soluble:Â Yes
$172.56EACH
Qty: | Price: | Savings |
---|---|---|
1 | $172.56 | |
5 | $163.93 | Save 5% |
10 | $158.76 | Save 8% |
20 | $151.85 | Save 12% |