Techni-Tool
Information notification:

October Exclusive: 10% Off Solder Wire & Bars – Use Code SOLDER10

ALPHA
ALPHA

ALPHA 259033.0070GME Capillary Underfill, CU11-3127, EFD Syringe, 70 gram, 50cc, CU11-3127 Series

Our Part #10020422

Condition:New

Mfr Part #259033.0070GME

ALPHA 259033.0070GME
ALPHA
ALPHA

ALPHA 259033.0070GME Capillary Underfill, CU11-3127, EFD Syringe, 70 gram, 50cc, CU11-3127 Series

Our Part #10020422

Condition:New

Mfr Part #259033.0070GME

Requires Dry Ice
WARNING
Has Expiration Date
RoHS
$117.32EACH
Multiples of: 6
Requires Dry Ice
Calif. Prop 65
Has Expiration Date
RoHS
  • More effective at higher operating temperatures than CU21-3240
  • Higher Tg is the key differentiator with Low CTE
  • Contains Anhydrides
  • NON-REWORKABLE

ALPHA HiTech CU11-3127 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. The high Tg, low CTE properties of ALPHA HiTech CU11-3127 protects the solder joints from mechanical stresses such as drop shock and impact bending. ALPHA HiTech CU11-3127, a product with high filler content, is available to provide better mechanical strength for CSP and Flip Chip packages. With a unique low viscosity property, no preheat is required for this product.

BrandALPHA
Alternate Product NumberCU11-3127
SeriesCU11-3127 Series
Shelf Life183 days
$117.32EACH
Multiples of: 6

Copyright © 1996–  TestEquity LLC.
All rights reserved.