• Low viscosity with fast flow at room temperature enabling fast & efficient flow properties. Saves takt time with larger components
  
• Passes 3,000 Cycles -40 to 125°C 30 min (TCT) with SAC-305 alloy
  
• Contains Anhydrides
  
• Halogen-free
  
• NON-REWORKABLE

ALPHA HiTech CU31-2030 is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. It is a low viscosity underfill which enables fast and efficient flow properties. In addition, it has a high Tg and low modulus which results in excellent reliability performance. ALPHA HiTech CU31-2030 is suitable for assembling BGA, CSP and Flip Chip devices. All ALPHA HiTech products are Halogen Free.
This is a one-component capillary underfill designed for the protection of assembled chip packages onto printed circuit boards. It is a low viscosity underfill which enables fast and efficient flow properties. In addition, it has a high Tg and low modulus which results in excellent reliability performance. ALPHA HiTech CU31-2030 is suitable for assembling BGA, CSP and Flip Chip devices. All ALPHA HiTech products are Halogen Free.