• Compatibility with common conformal coatings
• Clear, benign residue
• Superior stencil life
• Exceptional wetting in air reflow
• Outstanding print characteristics
• Halogen-free

Solder Paste

Indium Corporation’s high quality solder pastes are uniquely formulated for superior performance to satisfy a variety of assembly requirements.

Indium Corporation produces a wide range of solder paste products to fit every need and challenge in the PCB Assembly and semiconductor manufacturing market space. Solder paste can be manufactured in hundreds of alloys and with powder size ranging from Type 3 to Type 8. Solder pastes are available for a wide variety of process deposition techniques, including printing, dipping, dispensing, jetting, and pin transfer assembly. Each formula is specifically designed to meet the gamut of manufacturing challenges that plague the electronics manufacturing industry. Whether you are dealing with warpage induced defects, voiding, insufficient solder paste volume, or electrical or mechanical reliability issues, Indium Corporation’s solder pastes allow for the lowest total cost of ownership and fewer end-of-line defects.

NC-SMQ®92H Solder Paste

NC-SMQ®92H is a halogen-free, air reflow, no-clean solder paste formulated for low flux spatter. It provides consistent fine-pitch paste deposition, and excellent stencil life and tack time. NC-SMQ®92H has a hard flux residue and can accommodate reflow temperatures higher than typically required for many Pb-containing alloys. NC-SMQ®92H meets or surpasses all ANSI/J-STD-004, -005 specifications and Bellcore test criteria.