• Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
  
• Flux meets J-STD-004B
  
• Repeatable and consistent printing characteristics
  
• Long stencil and tack life to facilitate high speed printing
  
• Excellent wettability
  
• Suitable for air or nitrogen atmospheres
  
• Medium soft, non-cracking residues

4900P solder paste is designed to facilitate high speed printing. It can yield brick-like prints even when using ultra-fine pitch stencils as small as to 0.3 mm.