Under some conditions of use, Hysol® printed circuit coatings may require adjustment of viscosity and/or film thickness, this can be done by adding solvent. LOCTITE STYCAST AC 0305 is a special blend of solvents designed to give moderately slow evaporation. Other solvents, such as Methyl Ethyl Ketone (MEK), Methoxy Propyl Acetate, Xylene, and Toluene, can be used alone or as a mixture depending on how coating will be applied and drying time desired. The evaporation rate of some recommended solvents starting with the fastest are as follows: Methyl Ethyl Ketone, Toluene, Xylene, Hysol® AC0305, Methoxy Propyl Acetate. Methyl Ethyl Ketone, Toluene, Xylene, Hysol® AC0305, Methoxy Propyl Acetate. Dilutions of 15-20% will generally be sufficient for most applications. Excess dilution may require additional applications to achieve the desired film build. When using solvents to dilute the coating, the board should be allowed to air dry at least 30 minutes at room temperature 25ºC to remove solvent before oven cure or applying additional coats. the board should be allowed to air dry at least 30 minutes at room temperature. to remove solvent before oven cure or applying additional coats.