Techni-Tool
AIM Solder
AIM Solder

AIM Solder SAC305-M8-T4-500GR JAR Solder Paste, No Clean, LF, T4, 88.5%, SAC305, 38 Micron Series

Our Part #480-485

Condition:New

Mfr Part #SAC305-M8-T4-500GR JAR

AIM Solder SAC305-M8-T4-500GR JAR
AIM Solder
AIM Solder

AIM Solder SAC305-M8-T4-500GR JAR Solder Paste, No Clean, LF, T4, 88.5%, SAC305, 38 Micron Series

Our Part #480-485

Condition:New

Mfr Part #SAC305-M8-T4-500GR JAR

Next Day Air Only
CA Prop 65
$130.00EACH
Quantity on Order:70
Qty:Price:Savings
1$130.00
5$123.50Save 5%
10$119.60Save 8%
20$114.40Save 12%
Next Day Air Only
Calif. Prop 65
  • Halogen-free
  • Low voiding on BGA and BTC components
  • REACH and RoHS compliant
  • High SIR/Electrically safe residue
  • Formulated for use with T4 and finer powders
  • Mitigates head-in-pillow

Developed in combination with T4 and finer mesh lead-free alloy powders, M8 paste provides stable transfer efficiencies required for today’s challenging applications. A novel activator system provides powerful, durable wetting action accommodating a wide range of profiling processes and techniques. M8 eliminates HiP defects on BGA and reduced voiding on QFN/BTC components while producing bright shiny solder joints. M8 leaves minimal, high purity residue, engineered to be safely left in place. Developed with the input of coating and cleaning industry partners, residues can be directly coated or easily removed.

Brand: AIM Solder
Alloy: SAC305
Flux Type: No Clean
Series: 38 Micron Series
Type: Solder Paste
Lead Free: Yes
Package Type: Jar
Lead Type: Lead Free
Volume: 500 g
Powder Mesh Size: T4
Halogen Content: Halogen Free
Metal %: 88.5 %
Composition: 96.5% Tin, 3% Silver, 0.5% Copper
Package: 500g Jar
$130.00EACH
Quantity on Order:70
Qty:Price:Savings
1$130.00
5$123.50Save 5%
10$119.60Save 8%
20$114.40Save 12%