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Kester Alpha Hitech Adhesives

Electronics that Last | ALPHA HiTech Adhesives from Kester
 

Download: Alpha HiTech Bonding Materials Brochure

Edgebond
Dispense and Cure on Edges or Corners of BGAs

ALPHA HiTech Edgebond is a one component, heat curable material for edge or corner bonding applications. Upon deposition, it will not flow beneath the BGA. The cured edgebond will help to strengthen the soldered assembled component so it can pass reliability tests such as Drop Shock, Impact Bend and Thermal Cycle (TCT).

ALPHA HiTech CF31-4010 Series

  • No Flow characteristics
  • Pass 2,700 cycles -40 +125 °C, 30 minutes TCT with SAC305 alloy
  • Pass 3,000 cycles -40 +150 °C, 30 minutes TCT with Innolot alloy

View Products

ALPHA HiTech CF12-4485B Series

  • 1 to 10°C storage condition
  • 7 days pot life at 25°C
  • Pass 1,500 cycles -40 +125 °C, 30 minutes TCT with SAC305 alloy
     

View Products


Underfill
Protect Solder Joints in BGA, CSP or Flip Chip

ALPHA HiTech Underfill is an epoxy based material to be dispensed on the edges of the BGA, CSP or Flip Chip devices. The material then flows beneath the component through capillary action.
Upon completion of the curing process, the cured underfill helps strengthen the soldered assembled component, allowing it to pass reliability tests such as Drop Shock, Impact Bend and Thermal Cycle (TCT).
ALPHA HiTech has developed Underfill to accommodate variations in customer requirements throughout the industry.

ALPHA HiTech CU31-2030 Series

  • Low viscosity, fast flow at room temperature
  • Pass 3,000 cycles -40 +125 °C, 30 minutes TCT with SAC305 alloy

View Products

ALPHA HiTech CU21-3240 Series

  • Fast flowing on 70 - 100 °C substrate temperature
  • Pass 5,000 cycles -40 +125 °C, 30 minutes TCT with SAC305 alloy

View Products

 

ALPHA HiTech CU13-3150 Series

  • Low viscosity, fast flow at room temperature
  • Low curing temperature at 80 °C for 30 minutes

View Products

ALPHA HiTech CU11-3127 Series

  • High glass transition temperature (Tg)
  • Low coefficient of thermal expansion (CTE)

View Products
 


Adhesive
Designed for a Wide Range of Applications

ALPHA HiTech SMD Adhesive is a fast heat curable surface mount adhesive, formulated for use on high-speed dispensers and screen printing applications. These products are designed for holding surface mount components during the wave soldering process.

ALPHA HiTech SM42-1311 Series

  • Specially designed for dispensing
  • Excellent thermal resistant adhesion to FR4, flexible polyimide and chip components

View Products

ALPHA HiTech SM42-120P Series

  • Low viscosity, fast flow at room temperature
  • Low curing temperature at 80 °C for 30 minutes
     

View Products

ALPHA HiTech Low Temperature Adhesive is designed for bonding temperature sensitive devices to a variety of plastic and metal surfaces, where the materials cannot withstand high curing temperatures. The camera module market is one example of where these adhesives are very applicable.

ALPHA HiTech AD13-9620B Series

  • Excellent adhesion & drop shock on Heat Sensitive Substrates, as low as 80 to 85°C curing temperature
  • Provides good adhesion on LCP and Nylon
  • Low RBO (Resin Bleed out ) performance

View Products

ALPHA HiTech AD43-9600W Series

  • Low curing temperature at 80 °C for 2 minutes (reflow)
  • Excellent high temperature adhesion to PMMA and very good on LCP and Nylon

View Products

ALPHA HiTech UV Adhesive is formulated to be cured at ambient temperature under ultraviolet light. These products can be used in various applications such as coating and fixing of components which require high tensile strength and moisture resistance.

ALPHA HiTech UP44-5566T Series

  • Curing in seconds under UV at room temperature
  • Excellent for high throughput manufacturing
  • Very good adhesion on PC and PMMA

View Products

 


Encapsulant
One Component, Intermediate Temperature, Fast Heat Curable Materials

ALPHA HiTech Encapsulant is a one component, intermediate temperature, fast heat curable material which is designed to mechanically protect assembled chips and encapsulated IC devices from dropping off or cracking.
These encapsulants are formulated for applications in portable devices requiring extra reliability protection. The smartphone market is one example of where these encapsulants are very applicable.

ALPHA HiTech EN21-4210 Series

  • Excellent adhesion property on FR4, flexible polyimide and chip components
  • Excellent water proofing protection, preventing migration formation

View Products

Kester Alpha Hitech Adhesives

Electronics that Last | ALPHA HiTech Adhesives from Kester
 

Download: Alpha HiTech Bonding Materials Brochure

Edgebond
Dispense and Cure on Edges or Corners of BGAs

ALPHA HiTech Edgebond is a one component, heat curable material for edge or corner bonding applications. Upon deposition, it will not flow beneath the BGA. The cured edgebond will help to strengthen the soldered assembled component so it can pass reliability tests such as Drop Shock, Impact Bend and Thermal Cycle (TCT).

ALPHA HiTech CF31-4010 Series

  • No Flow characteristics
  • Pass 2,700 cycles -40 +125 °C, 30 minutes TCT with SAC305 alloy
  • Pass 3,000 cycles -40 +150 °C, 30 minutes TCT with Innolot alloy

View Products

ALPHA HiTech CF12-4485B Series

  • 1 to 10°C storage condition
  • 7 days pot life at 25°C
  • Pass 1,500 cycles -40 +125 °C, 30 minutes TCT with SAC305 alloy
     

View Products


Underfill
Protect Solder Joints in BGA, CSP or Flip Chip

ALPHA HiTech Underfill is an epoxy based material to be dispensed on the edges of the BGA, CSP or Flip Chip devices. The material then flows beneath the component through capillary action.
Upon completion of the curing process, the cured underfill helps strengthen the soldered assembled component, allowing it to pass reliability tests such as Drop Shock, Impact Bend and Thermal Cycle (TCT).
ALPHA HiTech has developed Underfill to accommodate variations in customer requirements throughout the industry.

ALPHA HiTech CU31-2030 Series

  • Low viscosity, fast flow at room temperature
  • Pass 3,000 cycles -40 +125 °C, 30 minutes TCT with SAC305 alloy

View Products

ALPHA HiTech CU21-3240 Series

  • Fast flowing on 70 - 100 °C substrate temperature
  • Pass 5,000 cycles -40 +125 °C, 30 minutes TCT with SAC305 alloy

View Products

 

ALPHA HiTech CU13-3150 Series

  • Low viscosity, fast flow at room temperature
  • Low curing temperature at 80 °C for 30 minutes

View Products

ALPHA HiTech CU11-3127 Series

  • High glass transition temperature (Tg)
  • Low coefficient of thermal expansion (CTE)

View Products
 


Adhesive
Designed for a Wide Range of Applications

ALPHA HiTech SMD Adhesive is a fast heat curable surface mount adhesive, formulated for use on high-speed dispensers and screen printing applications. These products are designed for holding surface mount components during the wave soldering process.

ALPHA HiTech SM42-1311 Series

  • Specially designed for dispensing
  • Excellent thermal resistant adhesion to FR4, flexible polyimide and chip components

View Products

ALPHA HiTech SM42-120P Series

  • Low viscosity, fast flow at room temperature
  • Low curing temperature at 80 °C for 30 minutes
     

View Products

ALPHA HiTech Low Temperature Adhesive is designed for bonding temperature sensitive devices to a variety of plastic and metal surfaces, where the materials cannot withstand high curing temperatures. The camera module market is one example of where these adhesives are very applicable.

ALPHA HiTech AD13-9620B Series

  • Excellent adhesion & drop shock on Heat Sensitive Substrates, as low as 80 to 85°C curing temperature
  • Provides good adhesion on LCP and Nylon
  • Low RBO (Resin Bleed out ) performance

View Products

ALPHA HiTech AD43-9600W Series

  • Low curing temperature at 80 °C for 2 minutes (reflow)
  • Excellent high temperature adhesion to PMMA and very good on LCP and Nylon

View Products

ALPHA HiTech UV Adhesive is formulated to be cured at ambient temperature under ultraviolet light. These products can be used in various applications such as coating and fixing of components which require high tensile strength and moisture resistance.

ALPHA HiTech UP44-5566T Series

  • Curing in seconds under UV at room temperature
  • Excellent for high throughput manufacturing
  • Very good adhesion on PC and PMMA

View Products

 


Encapsulant
One Component, Intermediate Temperature, Fast Heat Curable Materials

ALPHA HiTech Encapsulant is a one component, intermediate temperature, fast heat curable material which is designed to mechanically protect assembled chips and encapsulated IC devices from dropping off or cracking.
These encapsulants are formulated for applications in portable devices requiring extra reliability protection. The smartphone market is one example of where these encapsulants are very applicable.

ALPHA HiTech EN21-4210 Series

  • Excellent adhesion property on FR4, flexible polyimide and chip components
  • Excellent water proofing protection, preventing migration formation

View Products

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