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Solder Paste for Stencil Printing Applications
Formula
Type
Easy Profile
256-HA No-Clean
Easy Profile 256 No-Clean
HydroMark 531 Water-Soluble
R562 Water-Soluble
Alloy
Sn63Pb37
Sn63Pb37
Sn63Pb37
Sn63Pb37
Product Characteristics
Designed
to provide maximum print characteristics and solderability.
For applications requiring the ultimate activity for difficult
to solder components and board surface metallizations. High
activity on all substrates, including OSPs. Excellent printing
characteristics to 0.4mm (16 mil) pitch. High print speeds
to 150 mm/sec (6"/sec)
Standard
no-clean paste for a wide variety of reflow profiles and printing
conditions. Industry standard formula performs well in a variety
of applications. Compatible with enclosed print head systems.
An all-purpose
water-soluble paste. Provides consistent hours of stable stencil
life, tack time, and printing characteristics.
The improved anti-slump characteristics and excellent solderability
to a wide range of surface and component lead metallizations
solves problems caused by slumping, bridging, and wetting.
Organic
acid, water-soluble solder paste designed to resist drying
out in low humidity or slumping in high humidity. Maintains
its print characteristics, tack and activity.
Air and nitrogen reflowable no-clean
solder paste specifically designed for the thermal requirements
of lead-free alloys. Paste flux allows joint appearances that
closely resemble that achieved with leaded alloys. High print
speeds up to 6"/s (150 mm/s).
Excellent printing characteristics to 16 and 20 mils pitch.
Excellent print and reflow for 0201 applications.
Air and nitrogen reflowable no-clean
solder paste specifically designed for the thermal requirements
of lead-free alloys. Exhibits excellent continual printability
at high speeds up to 6"/s (150 mm/s). Soft ICT pin probeable
residues.
Excellent solderability to a wide variety of surface metallizations.
Capable of 90 minute break times in printing. Excellent printing
characteristics to 16 and 20 mils pitch and reflow characteristics
for 0201 applications.
Robust printing characteristics result
in consistent solder paste volume regardless of idle time,
stencil life and print speed. Very aggressive and provides
superior wetting to OSP coated and immersion silver boards.
Capable of 60+ minute idle times in printing.
Excellent anti-slump characteristics minimizing bridging defects,
Print speeds up to 150 mm/s (6"/s). Excellent solderability
to a wide variety of metallizations
including Palladium. Compatible with enclosed
print head systems.
Combines long stencil life and tack
time with exceptional solderability to a wide variety of
metallic substrates. Formulated to release consistently from
the stencil for critical fine pitch applications.
Extremely aggressive activator providing superior wetting
to OSP coated and immersion gold over electroless nickel boards.
Print speed up to 150 mm/s (6"/s). Reduces scrap due
to less paste dry out.
Provides optimal performance
in all types of dispensing applications. Packaged void-free
to ensure consistent dispensing in high speed automated processes.
Exhibits excellent dispensing characteristics with a wide
range of needle diameters.
The activator package
in this formula is aggressive enough to remove tenacious oxide
layers or solder to OSP coated boards. R500 delivers excellent
wetting characteristics.
