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Solder Paste for Stencil Printing Applications
Formula Type
Easy Profile 256-HA No-Clean
Easy Profile 256 No-Clean
HydroMark 531 Water-Soluble
R562 Water-Soluble
Alloy
Sn63Pb37
Sn63Pb37
Sn63Pb37
Sn63Pb37
Product Characteristics
Designed to provide maximum print characteristics and solderability. For applications requiring the ultimate activity for difficult to solder components and board surface metallizations. High activity on all substrates, including OSPs. Excellent printing characteristics to 0.4mm (16 mil) pitch. High print speeds to 150 mm/sec (6"/sec)
Standard no-clean paste for a wide variety of reflow profiles and printing conditions. Industry standard formula performs well in a variety of applications. Compatible with enclosed print head systems.
An all-purpose water-soluble paste. Provides consistent hours of stable stencil life, tack time, and printing characteristics.
The improved anti-slump characteristics and excellent solderability to a wide range of surface and component lead metallizations solves problems caused by slumping, bridging, and wetting.
Organic acid, water-soluble solder paste designed to resist drying out in low humidity or slumping in high humidity. Maintains its print characteristics, tack and activity.
Air and nitrogen reflowable no-clean solder paste specifically designed for the thermal requirements of lead-free alloys. Paste flux allows joint appearances that closely resemble that achieved with leaded alloys. High print speeds up to 6"/s (150 mm/s).
Excellent printing characteristics to 16 and 20 mils pitch. Excellent print and reflow for 0201 applications.
Provides optimal performance in all types of dispensing applications. Packaged void-free to ensure consistent dispensing in high speed automated processes. Exhibits excellent dispensing characteristics with a wide range of needle diameters.
The activator package in this formula is aggressive enough to remove tenacious oxide layers or solder to OSP coated boards. R500 delivers excellent wetting characteristics.
