The Hakko FR-1418 BGA Rework System is a low cost and flexible system designed for the alignment and placement or removal of surface mount components. The FR-1418 provides precisely controlled and repeatable solder reflow profiles. The system features a unique gantry style construction which allows the PCB to remain stationary while the head moves to accomplish the X, Y, Z, and Theta alignment.

The system top heater is a 1000 watt forced convection/ hot gas type and is integrated into the placement head. The bottom heater is a large area, low mass infra-red heater that provides fast and efficient heating. Preheaters are available in 10" x 12" or 20" x 12" configurations.

The optical alignment system uses a CCD camera with a flat mirror and beam splitting prism for easy alignment of BGA and other area array devices. The prism provides an "up" view of the component and a "down" view of the PCB simultaneously. Alignment is a simple as matching the views. The control system features a powerful microprocessor, non-volatile memory and four thermocouple inputs.

The system includes a PC with flat panel monitor to operate the Thermal Analysis and Control software. The software allows thermocouple graphing and analysis with unlimited recipe storage. Parameters for the preheat, soak, reflow, and cooling stages of each recipe are controlled by the software. The software has teach-mode profiling which uses the thermocouple feedback to automatically set the profile time. An auto-profiling option is also available. Password protection maintains process control and guards against operators changing reflow parameters. Data graphs can be saved as images and include tools for calculating slope and marking time/temperature data points.